Full Description

Specifies the principle and method for scale adhesion testing for oxygen-free high conductivity copper, primarily for use in electronic devices involving glass to metal seals or other uses requiring an adherent film of copper oxide.

Product Details

Published: 04/30/1980 ISBN(s): 0580112659 Number of Pages: 2File Size: 1 file , 290 KB Product Code(s): 00027795, 00027795, 00027795 Note: This product is unavailable in United Kingdom