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Full Description
Specifies the data format for the exchange of data pertaining to bare semiconductor die, with or without connection structures, and minimally-packaged semiconductor die. It also gives definitions of all parameters used according to the principles and methods of IEC 61360.
Cross References: ES 59008-1*ES 59008-2*ES 59008-3*ES 59008-4-1*ES 59008-4-3*ES 59008-4-4*IEC 61360*ISO 8601:1988*ANSI X3.30*ISO 6093:1985*Product Details
Published: 12/15/1999 ISBN(s): 0580357570 Number of Pages: 42File Size: 1 file , 870 KB Product Code(s): 19977585, 19977585, 19977585 Note: This product is unavailable in United Kingdom