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EIA JESD 22-B106E:2016 Resistance to Solder Shock for Through-Hole Mounted Devices
EIA JESD 22-B105E:2018 Lead Integrity
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EIA JESD 22-B101C:2015 External Visual
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EIA JESD 22-A108F:2017 Temperature, Bias, and Operating Life
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EIA JESD 217.01:2016 Test Methods to Characterize Voiding in Pre-SMT Ball Grid Array Packages
EIA JESD 214.01:2017 Constant-Temperature Aging Method to Characterize Copper Interconnect Metallization for Stress-Induced Voiding
EIA JESD 210A:2017 Avalanche Breakdown Diode (ABD) Transient Voltage Suppressors
EIA JESD 209-4B:2017 Low Power Double Date Rate 4 (LPDDR4)