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EIA JEP 131C:2018 Potential Failure Mode and Effects Analysis (FMEA)
EIA JEP 130B:2016 Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes, Trays, and Tape and Reel)
EIA JEP 122H:2016 Failure Mechanisms and Models for Semiconductor Devices
EIA JEP 001-3A:2018 FOUNDRY PROCESS QUALIFICATION GUIDELINES - PRODUCT LEVEL (Wafer Fabrication Manufacturing Sites)
EIA JEP 001-2A:2018 FOUNDRY PROCESS QUALIFICATION GUIDELINES - FRONT END TRANSISTOR LEVEL (Wafer Fabrication Manufacturing Sites)
EIA JEP 001-1A:2018 FOUNDRY PROCESS QUALIFICATION GUIDELINES - BACKEND OF LINE (Wafer Fabrication Manufacturing Sites)
EIA J-STD-111:2014 Joint ATIS/TIA Standard on Coexistence and Interference Issues in Land Mobile Systems
EIA J-STD-075A:2018 Classification of Passive and Solid State Devices for Assembly Processes
EIA J-STD-042-B:2013 Emergency Alert Messaging for Cable
EIA J-STD-033D:2018 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
EIA J-STD-033D:2018 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
EIA CTA/CEDIA-CEB 24-A:2017 Home Theater HVAC